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issue no. : 151exb008057 date of issue : digi-key corporation classification : ? new ? changed : chip resistor array (rohs compliance) : : japan, china, malaysia : standard electronic equipment *if you approve this specification, please fill in and sign the below and return 1 copy to us. approval no : approval date : executed by : (signature) title : dept. : circuit components business unit prepared by : engineering section panasonic electronic devices co., ltd. contact person : signature 401 sadamasa-cho, name(print) h.yabukoshi fukui city 910-8502 japan title : authorized by : phone : +81-776-56-8034 signature fax : +81-776-56-3114 name(print) t.watanabe title : manager of engineering november 26.2008 applications p roduct specification for approva l product description product part number country of origin
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-1 panasonic electronic devices co.,ltd. 1. dimension l w t a b dimension(mm) 3.20 1.60 0.60 0.10 0.60 0.10 0.30 0.15 d p e g dimension(mm) (0.30) (0.80) 0.45 0.10 0.45 0.15 2. power derating curve 100 80 60 40 20 0 20 0 120 100 -40 -20 -60 80 60 40 140 160 -55 c 70 c 125 c ambient temperature( c) fig. 1 % of rated dissipation category temperature range -55 c to +125 c 3. ratings item rated value explanation 0.063 w / element when used at ambient temperature over 70 c, the rated dissipation should be reduced as shown in fig.1 rated dissipation chip jumper : rated current 1 a (resistance is less than 50 m ) rated voltage & rated continuous working voltage (rcwv) the rated voltage of each resistor should be calculated from the equation below, and when the rated voltage exceeds the limiting element voltage, the limiting element voltage should the maximum working voltage. e = p r limiting element voltage : 50 v e: rated voltage(v), p: rated dissipation(w), r: rated resistance( ) (1) (2) (3) (4) (5) (6) a-a? sectional plan t w l a? 8- d p a b b a e g (1)substrate (2)protective coating (3)resistive element a lumina resin ruthenium oxide (4)termination (inner) (5)termination (between) (6) termination (outer) a g or ag/pd ni plating sn plating +0.20 -0.10 +0.20 -0.10 ( ) : reference
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-2 panasonic electronic devices co.,ltd. item rated value explanation maximum overload voltage voltage should be 2.5 e. when the voltage exceeds the maximum overload voltage, the value shown below should be the maximum overload voltage. maximum overload voltage: 100v chip jumper: max. overload current 2a resistance tolerance range of rated resistance for manufacture 4. explanation of part number e x b v 8 v 1 0 2 j v thick film resistor networks chip resistor array isolated circuit rated resistance tolerance packaging number of terminals r 0 0 0 chip jumper 5. appearance & construction item specifications explanation appearance & construction 1. the resistive element should be covered with protective coating that do not fade easily. the surface of coating should avoid unevenness, flaw, pinhole and discoloration. 2. the electrode should be printed uniformly, as shown in the dimensions. the plating should not fade easily, and should avoid unevenness, flaw, pinhole, proj ection and discoloration. 3. the electrode should be connected electrically, mechanically to resistive element. 4. substrate should not have chipping, flaw, flash and crack. details of appearance criteria shall be as described in attached sheet sign tolerance for resistance j 5% 0 chip jumper part no. v8v circuit 1234 8765 packaging code taping (5,000pcs/reel) v tolerance resistance range series j 1.0 to 1.0 m e-24 0 less than 50 m -
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-3 panasonic electronic devices co.,ltd. as far as there shall be not designation espe cially, the following test and measurement shall be operated under normal temperature(15 c to 35 c), normal humidity (25 %rh to 75 %rh), normal atmosp heric pressure(86 kpa to 106 kpa). 6. performance specification specification item resistor jumper test methods dc resistance dc resistance value shall be within the specified tolerance less than 50 m measuring voltage: re fer to jis-c5201-1 at 20 c, 65 %rh resistance tcr < 10 10 -6 / c 10 to 1m 200 10 -6 / c temperature coefficient chip jumper : less than 50 m natural resistance change per temperature degree centigrade. r 2 - r 1 r 1 (t 2 - t 1 ) r 1 : resistance value at reference temperature(t 1 ) r 2 : resistance value at test temperature(t 2 ) t 2 - t 1 = 100 c, t 1 = 25 c overload (2 %+0.1 ) less than 50 m resistors shall be applied 2.5 times the rated voltage for 5 seconds. maximum over load voltage shall be 100 v. intermittent overload (5 %+0.1 ) less than 50 m resistors shall be subjected to 10000 cycles of 2.5 times the rated voltage applied for 1 second with pause of 25 seconds between tests. maximum over load voltage shall be 100 v dielectric withstanding no evidence of flashover, mechanical damage, arcing or insulation breakdown. a c 100v between substr ate and termination for 1 minute. insulation resistance min. 1,000 m insulation resistance between substrate and termination shall be measured at dc 100v. 7. mechanical characteristic specification item resistor jumper test methods no mechanical damage bend strength of the face plating (1 %+0.05 ) less than 50 m substrate: glass epoxy(t = 1.6 mm) span: 90 mm bending distance: 3 mm (10 seconds) solderability termination should be covered uniformly with solder. (min. 95 % coverage) resistors shall be dipped in the melted solder bath at 235 c 5 c for 2 s 0.5 s. flux shall be removed from the surface of termination with clean organic solvent. tcr= +600 ? 100
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-4 panasonic electronic devices co.,ltd. specification item resistor jumper test methods resistance to soldering heat (1 %+0.05 ) less than 50 m resistors shall be dipped in the melted solder bath at 270 c 5 c for 10s 1s. vibration (1 %+0.05 ) less than 50 m resistors shall be subjected to a single vibration having as double amplitude of 1.5 mm for 2 hours in each three mutually perpendicular directions for total 6 hours. the vibration frequency shall be varied uniformly 10 hz to 55 hz and return to 10 hz traversing for 1 minute. without distinct deformation in appearance solvent resistance (0.5 %+0.05 ) less than 50 m solvent solution: isopropyl alcohol (1) dipping 10 hours 1 hour, dry in room condition for 30 min 10 min. (2) ultrasonic wave washing: 5 min 1 min (0.3 w/cm 2 ,28 khz) dry in room condition for 30 min 10 min. 8. environmental test specification item resistor jumper test methods low temperature exposure (1 %+0.05 ) less than 50 m resistors shall be exposed at -55 c 3 c for 1000 hours hours endurance at upper category temperature (1 %+0.05 ) less than 50 m resistors shall be exposed at +125 c 3 c for 1000 hours hours. temperature cycling (1 %+0.05 ) less than 50 m -55 c 3 c, 30 minutes nominal temp., 30minutes 25cycles +125 c 3 c, 30minutes humidity (steady state) (1 %+0.05 ) less than 50 m resistors shall be exposed at 60 c 2 c and 90 % to 95 % relative humidity in a humidity test chamber for 1000 hours hours. endurance at 70 c (3 %+0.1 ) less than 50 m resistors shall be exposed at 70 c 2 c for 1000 hours hours. during this time, the rated voltage shall be applied intermittently for 1.5 hours on, 0.5 hour off. load life in humidity (3 %+0.1 ) less than 50 m resistor shall be exposed at 60 c 2 c and 90 % to 95 % relative humidity for 1000 hours hours. during this time, the rated voltage shall be applied interm ittently for 1.5 hours on, 0.5 hour off. +48 0 +48 0 +48 0 +48 0 +48 0
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-5 panasonic electronic devices co.,ltd. 9. resistance value marking express resistance value on resin side with three digits. (example) 103 10 k the first two digits should be significant figures of resistance for e-24 series and the third one denotes number of zeros in ohms. 000 chip jumper
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-6 panasonic electronic devices co.,ltd. 10. notice for use notice for use (1)this specification shows the quality and performance of the product in a unit component. before adoption, be sure to evaluate and verify the product mounting it in your product. (2)we take no responsibility for troubles caused by the product usage that is not specified in this specification. (3)in traffic transportation equipment (trains, cars, traffic signal equipment, etc.), medical equipment, aerospace equipment, electric heat ing appliances, combustion and gas equipment, rotating equipment, disaster and crime preventive equipment, etc. in cases where it is forecast that the failure of this product gives serious dama ge to human life and others, use fail-safe design and ensure safety by studying the following items to ? ensure safety as the system by setting prot ective circuits and protective equipment. ? ensure safety as the system by setting such re dundant circuits as do not cause danger by a single failure. (4)when a dogma shall be occurred abo ut safety for this product, be sure to inform us rapidly, operate your technical examination. (5) the product is designed to use in general standard applications of general electric equipment (av products, household electric appliances, o ffice equipment, information and communication equipment, etc.); hence, it do not take the use under the following special environments into consideration. accordingly, the use in the fo llowing special environments, and such environmental conditions may affect the performance of the product; prior to use, verify the perfor mance, reliability, etc. thoroughly. 1) use in liquids such as water, oil, chemical, and organic solvent. 2) where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 3) where the product is sealed or coated with resin, etc. 4) where water or a water-soluble detergent is us ed in cleaning free soldering (pay particular attention to soluble flux.) 5) use in such a place where the product is wetted due to dew condensation. 6) use in places full of corrosive gases such as sea breeze, cl 2 , h 2 s, nh 3 , so 2 , and no x . 7) use under direct sunlight, in outdoor or in dusty atmospheres. 8) use in environment with large static electricity or strong electromagnetic waves. (6)if transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with resistors actually mounted on your own board. when the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resi stor. never exceed the rated power. when the product shall be used under special condition, be sure to ask us in advance. (7)halogen type (chlorine type, bromine type, etc.) or other high-activity flux is not recommended as the residue may affect performanc e or reliability of resistors. (8)when soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. when using a soldering iron with a tip at high temperature, solder for a time as short as possible. (three seconds or less up to 350 c) (9)avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective firm or the body of resistor and may affect resistor?s performance. (10)reflow soldering method shall appl y to this product in principle. !
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-7 panasonic electronic devices co.,ltd. 11. storage method if the product is stored in the following environments and conditions, the performance and solderability may be badly affected. avoi d the storage in the following environments. (1) storage in places full of corrosive gases such as sea breeze, cl 2 , h 2 s, nh 3 , so 2 , and no x. (2) storage in places exposed to direct sunlight. (3) storage in places outside the temperature range of 5 c to 35 c and humidity range of 45 %rh to 85 %rh. (4) storage over a year after our delivery (this item also applies to the case where the storage method specified in item (1) to (3) has been followed.). 12. laws and regulations (1) no odcs or other ozone-depleting substances that are subject to regulation under the montreal protocol are used in our manufacturi ng processes, including in the manufacture of this product. (2) this product complies with the rohs directive (restriction of the use of certain hazardous substances in electrical and el ectronic equipment (directive 2002/95/ec)). (3) all materials used in this product are existing chemical substances recognized under "lows on examination of chemical substances and regulations of manufacturing and others." (4) none of the materials used in this product contain the designated incombustible bromic substances, pbbos and pbbs. (5) please contact us to obtain a notice as to whether this product has passed inspection under review criteria primarily based on fo reign exchange and fo reign trade control laws, and appended table in the export control laws. 13. production place production country : japan production plant : panasonic electronic devices japan co.,ltd. production country : china production plant : panasonic electronic devices (tianjin) co., ltd. (pedtj) production country : malaysia production plant : panasonic electronic devices malaysia sdn. bhd. (pedma)
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-8 panasonic electronic devices co.,ltd. 14. tape and reel package 14-1. physical dimensions structure and reel dimensions shall be as shown in the figure below. inaccordance with eiaj et-7200. 14-2. carrier tape dimensions sprocket hole chip hole p1 p0 p2 a d0 e w f t b chip resistor array a b w f e (mm) 1.95 0.15 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 p1 p2 p0 t d0 (mm) 4.00 0.10 2.00 0.05 4.00 0.10 0.84 0.05 1.50 14-3. specification 14-3-1. taping (1) when the test shall be operated with the below conditions, peel strength should be 0.049n to 0.49n, should not have flash and tear after peeling. (2) minimum bending radius when carrier tape shall be bent by minimum be nding radius (15 mm), no defection of chip and no break of carrier tape. however minimu m bending radius shall be tested for 1 times. +0.10 0 peeling direction top tape 10 carrier tape carrier ta p e to p ta p e adhesive ta p e unit : mm min. 60.0 11.4 +/- 1.0 9.0 +/- 1.0 180.0 +0 / -3.0 13.0 +/- 1.0 min. 60.0
subject chip resistor array product specification for information spec. no. 151-exb-v8v01ne part no. exbv8v 9-9 panasonic electronic devices co.,ltd. (3) resistance to climate when resistors shall be exposed at 60 c 2 c, 90 %rh to 95 %rh for 120 hours, no defection of chip and no break off carrier tape. when the top tape shall be peeled , tape should not have flash and tear. 14-3-2. quantity in taping: 5,000 pcs. / reel 14-3-3. tape packaging (1) resistor side shall be facing upward. (2) chip resistor shall not be sticking to top tape and bottom tape. (3) chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole shall not have flash and break. 14-4. outer packaging quantity: 20 reels(max.100,000 pcs.) tape marking (1) when packaging quantity does not re ach max quantity, the remaining empty space shall be buried with buffer material. (2) when quantity shall be few, alternat ive packaging methods may used. no problem must occur during the exportation of the product.. 14-5. marking at last, production country is displayed in english. ? side of reel (marking shall be on one side.) (1)part name (2)part number (3 )quantity (4)lot number (5)maker name (6)production country ? packaging box (1)customer name (2)part name (3)part number (4)customer part number (5)quantity (6)maker name (7) production country
subject chip resistor array product specification for information spec. no. attached sheet appearance quality criteria 1-1 panasonic electronic devices co.,ltd. item defect criteria appearance criteria remark resin chipping w b c a a w/16 b c/2 both side chipping shall be judged defect terminal chipping b c oblique line show chipping through hole terminal chipping a a 1/2 of radius b top terminal width d 1/2 of radius through hole?s chipping area is within 1/4 of through hole?s area. pin hole one pin hole / chip resistor 0.2 mm this item is applied to pin holes which reach to the resistive materials flash a a a 100 m

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